Conductor patterned substrate providing stress release during di

Details Conductor patterned substrate providing stress release during di Conductor patterned substrate providing stress release during di

1975-11-18

1977-09-13

Reynolds, Bruce A.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29625, 357 70, H05K 102, H01L 2348

Patent

active

040484386

ABSTRACT:
An improved conductor patterned substrate assembly is disclosed which permits direct attachment of integrated circuit chips to a metallized array while preventing stress buildup due to thermal cycling and/or bonding temperatures. A circuit is formed on a flexible substrate of insulative material which is suitable for withstanding solder, thermal compression bonding, or eutectic die attachment temperatures. The circuit includes a fine line pattern of leads extending up to the edge of a hole in the substrate substantially centered within the pattern of the integrated circuit pad dimensions. The subject assembly can thus be used face down bonding of integrated circuit chips which have bump metallization on the contact pads thereof. Thermal distortion of the substrate during bonding is minimized by the central hole thus preventing undue stresses from being applied to the chip bonds by the substrate. The assembly also provides for full support for the conductor leads throughout their entire length, in order to maintain dimensional and spacial stability especially for bonding larger multi-pad chips.

REFERENCES:
patent: 3052823 (1962-09-01), Anderson et al.
patent: 3256465 (1966-06-01), Weissentern et al.
patent: 3390308 (1968-06-01), Marley
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3683105 (1917-08-01), Shamash et al.
patent: 3689991 (1972-09-01), Aird
patent: 3778686 (1973-12-01), Galvin
patent: 3781596 (1973-12-01), Galli et al.
patent: 3795043 (1974-03-01), Farlani
patent: 3838984 (1974-10-01), Crave et al.

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