Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1995-01-27
1996-05-07
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428209, 428901, 65 331, 65 335, 65 337, 65 339, 156 89, 501 6, B32B 900
Patent
active
055144519
ABSTRACT:
Conductive via fill inks for green tapes to be stacked and bonded to a support substrate, the glass used for the green tape having a firing temperature from 850.degree.-950.degree. C., wherein the glass used for the via fill ink has a glass transition temperature that is higher than that of the glass used to make the green tape, preferably does not crystallize at the maximum firing temperature of the green tape and comprises from 30-75 percent by volume of the glass-conductive metal powder mixture of the via fill ink. These conductive via fill inks will not shrink until the green tape shrinkage has commenced during firing of the composite circuit board and they will flow slightly during firing, forming good bonds to the glass in the walls of the vias, thereby ensuring good integrity of the vias and good connections to the circuitry on the fired ceramic multilayer circuit board.
REFERENCES:
patent: 3944696 (1976-03-01), Larry
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4795670 (1989-01-01), Nishigaki et al.
patent: 4799983 (1989-01-01), Desai
patent: 5145540 (1992-09-01), Foley et al.
patent: 5232765 (1993-08-01), Yano et al.
patent: 5277724 (1994-01-01), Prabhu
Kumar Ananda H.
Prabhu Ashok N.
Thaler Barry J.
Tormey Ellen S.
Burke William J.
David Sarnoff Research Center Inc.
Lee Kam F.
Ryan Patrick J.
LandOfFree
Conductive via fill inks for ceramic multilayer circuit boards o does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive via fill inks for ceramic multilayer circuit boards o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive via fill inks for ceramic multilayer circuit boards o will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1225744