Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-27
2010-02-09
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE23069, C438S629000, C029S852000
Reexamination Certificate
active
07659193
ABSTRACT:
Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.
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Hsu Shih-Ping
Hu Wen-Hung
Shih Chao-Wen
Wang Ying-Tung
Coleman W. David
Kim Su C
Phoenix Precision Technology Corporation
Sawyer Law Group P.C.
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