Conductive particle transferring method

Details Conductive particle transferring method Conductive particle transferring method

1997-09-15

2000-05-16

Graybill, David E.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

22818022, H01L 21283

Patent

active

060637013

ABSTRACT:
A process for manufacturing a device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode pads of a semiconductor chip or the leads of a TAB (Tape Automated Bonding) tape and a conductive particle transferring method using the same are disclosed.

REFERENCES:
patent: 4092445 (1978-05-01), Tsuzuki et al.
patent: 4906823 (1990-03-01), Kushima et al.
patent: 5842273 (1998-12-01), Schar
patent: 5857610 (1999-01-01), Hoshiba et al.

Affiliated with

Also associated with

Rating

Conductive particle transferring method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive particle transferring method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive particle transferring method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-258524