Conductive pad

Details Conductive pad Conductive pad

2005-04-08

2008-09-23

Bell, Bruce F (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S22400M, C204S22400M, C451S533000, C451S534000, C451S539000

Reexamination Certificate

active

07427340

ABSTRACT:
A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised features are adapted to polish the feature surface of a substrate and define channels therebetween. The conductive processing pad may have lower features made of a conductive composite that extend into the sub-pad from the conductive carrier. The conductive processing pad is adhered to a sub-pad bound to an opposing conductive layer and the opposing conductive layer bound to a platen assembly.

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