Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-11-16
1991-02-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 29846, 1566591, 156666, 156902, 427 97, 428139, 428209, 428901, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
049921398
ABSTRACT:
A first conductive layer 12 is deposited on the substrate 14. Next, a second conductive layer 16 with a circuit pattern is deposited on the first layer 12. Finally, the first conductive layer 12 not residing under the second conductive layer 16 is etched off, leaving the second layer 16 above the first layer 12.
REFERENCES:
patent: 3287191 (1966-11-01), Borth
patent: 4293377 (1981-10-01), Miyajima
patent: 4323593 (1982-04-01), Tsunashima
patent: 4755551 (1988-07-01), Nakano et al.
patent: 4814040 (1989-03-01), Ozawa
patent: 4827326 (1989-05-01), Altman et al.
Printed Circuit Design Handbook, Manufacture, Components & Assembly, 1982, 1981 by Electrochemical Publications Ltd., (pp. 198-204).
Printed Circuit Handbook.COPYRGT. 1979, Chapter 6, 1967 by McGraw Hill, Inc. by Ernest Armstrong and Edward F. Duffek.
Flexible Circuits.COPYRGT. 1984 by Marcel Dekker, Inc., Steve Gurley.
Davis James L.
Mulligan Robert J.
Pennisi Robert W.
Suppelsa Anthony B.
Meles Pablo
Motorola Inc.
Nichols Daniel K.
Powell William A.
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