Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-04-30
1998-09-01
Whitehead, Jr., Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257777, 257778, 257685, 257723, H01L 2348
Patent
active
058014489
ABSTRACT:
An apparatus and a method for increasing integrated circuit density comprising semiconductor wafers, wafer portions or dice ("semiconductor elements") having conductive traces on the back side thereof. These semiconductor elements are stacked such that the traces on the back side of an upper semiconductor become part of the interconnect traces of the semiconductor stacked below. The traces lead to one or more edges of the semiconductor element such that the traces can make electrical contact with an external substrate, leadframe, or wiring arrangement.
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Micro)n Technology, Inc.
Whitehead Jr. Carl W.
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