Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1998-09-25
2000-10-10
Chaudhuri, Olik
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438792, 257 59, H01L 29786
Patent
active
061301191
ABSTRACT:
A method of manufacturing a conductive film-attached substrate wherein a nitride film is formed on an insulating substrate and on at least part of an oxide conductive film formed on the substrate, which is characterized in that after a first silicon nitride film is formed in an atmosphere which is incapable of inducing a reductive effect on the oxide conductive film, a second silicon nitride film is superimposed on the first silicon nitride film under a condition which enables to achieve a faster film-forming rate than that of the first silicon nitride film.
REFERENCES:
patent: 5243202 (1993-09-01), Mori et al.
patent: 5367179 (1994-11-01), Mori et al.
patent: 5663087 (1997-09-01), Yokozawa
patent: 5739877 (1998-04-01), Onisawa et al.
Chaudhuri Olik
Duy Mai Anh
Kabushiki Kaisha Toshiba
LandOfFree
Conductive film-attached substrate and method of manufacturing t does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductive film-attached substrate and method of manufacturing t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive film-attached substrate and method of manufacturing t will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2255680