Conductive etch stop for etching a sacrificial layer

Details Conductive etch stop for etching a sacrificial layer Conductive etch stop for etching a sacrificial layer

2006-05-16

2006-05-16

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S052000

Reexamination Certificate

active

07045381

ABSTRACT:
In one embodiment, a method of forming a metallic electrode comprises depositing a metal layer over a surface (e.g., substrate) and thermally processing the metal layer to form a conductive metallized ceramic. The metal layer may be deposited by sputtering and thermally processed by rapid thermal processing, for example. Among other advantages, embodiments of the present invention allow for the formation of conductive metallized ceramics, such as titanium-nitride, without the use of relatively expensive deposition tools.

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