Conductive ball mounting method and apparatus having a...

Details Conductive ball mounting method and apparatus having a... Conductive ball mounting method and apparatus having a...

2008-07-17

2010-11-09

Nguyen, Thanh (Department: 2893)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257SE21476

Reexamination Certificate

active

07829451

ABSTRACT:
A method of mounting conductive balls on pads on a substrate includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.

REFERENCES:
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patent: 2008/0217386 (2008-09-01), Iida et al.
patent: 2008/0301935 (2008-12-01), Iida et al.
patent: 02-102538 (1990-04-01), None
patent: 11-297886 (1999-10-01), None
patent: 2000-332043 (2000-11-01), None
patent: 2001-338942 (2001-12-01), None

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