Conductive adhesive for thinned silicon wafers with through...

Details Conductive adhesive for thinned silicon wafers with through... Conductive adhesive for thinned silicon wafers with through...

2008-05-13

2009-06-02

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C257SE21521

Reexamination Certificate

active

07541203

ABSTRACT:
The present invention relates to a process for preparing a thinned silicon wafer for electrical testing, the thinned silicon wafer comprising at least one circuit design and at least one through-silicon via or hole; the process comprising temporarily attaching the thinned silicon wafer to a mechanical handler by means of an electrically conductive polymeric adhesive material.

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patent: 2007/0155029 (2007-07-01), Hamren et al.
patent: WO 00/31784 (2000-06-01), None

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