Conductive adhesive film techniques

Details Conductive adhesive film techniques Conductive adhesive film techniques

1992-02-20

1993-06-22

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156300, 1563066, 174117A, B29C 6502, H01B 708

Patent

active

052214176

ABSTRACT:
In one embodiment of the invention, photolithographic masking and etching is used to form a matrix array of mutually isolated ferromagnetic elements (25'). The elements are magnetized and a single layer of conductive ferromagnetic particles (33) is adhered to an upper surface of each of the ferromagnetic elements. The layer of particles is contacted with a layer of soft adhesive polymer (36) to cause penetration of the particles into the polymer. The adhesive polymer is then hardened to assure containment of the particles in the polymer. The hardened adhesive polymer is removed and located between the first and second conductor arrays (40-43) that is to be interconnected; for example, it is located between the bonding pads (43) of a chip (42) and the bonding pads (40) of a substrate (39) to which the chip is to be connected. The adhesive polymer is then softened by heating and compressed between the first and second conductor arrays to cause it to adhere to the conductor arrays and to interconnect them and is thereafter hardened to form a unified structure.

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"Packaging Ideas," Electronic Packaging & Production, edited by H. Markstein, Oct. 1990, p. 47.

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