Conditioning mechanism for chemical mechanical polishing

Details Conditioning mechanism for chemical mechanical polishing Conditioning mechanism for chemical mechanical polishing

2005-06-14

2005-06-14

Hail, III, Joseph J. (Department: 3723)

Abrading

Machine

Combined

C451S041000, C451S057000, C451S063000, C384S132000

Reexamination Certificate

active

06905399

ABSTRACT:
Embodiments of a conditioning mechanism for a chemical mechanical polishing system have been provided. In one embodiment, a conditioning mechanism includes a rotor assembly and a conditioning element mounting assembly. A seal is disposed between the rotor assembly and conditioning element mounting assembly and bounds one surface of an expandable plenum defined between the rotor assembly and conditioning element mounting assembly. A spring is disposed between the rotor and conditioning element mounting assemblies and is adapted to bias a lower surface of the conditioning element mounting assembly towards the rotor assembly.

REFERENCES:
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patent: 2001/0006873 (2001-07-01), Moore
patent: 2003/0166383 (2003-09-01), Kimura et al.

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