Conditioner head in a substrate polisher and method

Details Conditioner head in a substrate polisher and method Conditioner head in a substrate polisher and method

1997-07-11

2000-03-14

Eley, Timothy V.

Abrading

Abrading process

With tool treating or forming

451288, B24B 100

Patent

active

060365838

ABSTRACT:
In one aspect, an apparatus and a method for use in substrate polishing are described wherein a conditioner head is provided for receiving an end effector for conditioning a polishing pad surface; the conditioner head is supported above the polishing pad surface to be conditioned; and the conditioner head is driven with an actuating force from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In another aspect, pneumatic pressure is supplied through the conditioner head support arm to apply actuating force to the conditioner head so that an end effector attached to the conditioner head can condition the surface of the polishing pad. In yet another aspect, the conditioner head support arm has a fluid channel extending therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned.

REFERENCES:
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5245796 (1993-09-01), Miller et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5531635 (1996-07-01), Mogi et al.
patent: 5626509 (1997-05-01), Hayashi

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