Abrading – Machine – Combined
Reexamination Certificate
2006-08-22
2009-08-25
Rose, Robert A. (Department: 3727)
Abrading
Machine
Combined
C451S443000, C451S056000
Reexamination Certificate
active
07578727
ABSTRACT:
The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.
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Ahn Bong-Su
Kang Kyoung-Moon
Kim Nam-Soo
Lee Dong-Jun
Moon Sung-Tae
Marger & Johnson & McCollom, P.C.
Rose Robert A.
Samsung Electronics Co,. Ltd.
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