Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2000-01-07
2001-09-25
Hail, III, Joseph J. (Department: 3723)
Abrading
Abrading process
With tool treating or forming
C451S288000, C451S443000, C451S450000
Reexamination Certificate
active
06293853
ABSTRACT:
BACKGROUND OF THE INVENTION
The invention relates to substrate polishing techniques, including chemical mechanical polishing (CMP).
Chemical mechanical polishing is a process by which a substrate surface is smoothed (planarized) to a uniform level by a polishing pad and an abrasive slurry. A substrate to be polished is usually mounted on a rotatable carrier head and pressed against a rotating polishing pad. The polishing pad typically consists of a disk with a roughened surface. An abrasive chemical solution (slurry) is deposited onto the polishing pad to achieve a desired substrate surface finish. Over time, the polishing process glazes the polishing pad and creates irregularities in the polishing pad surface that can adversely affect the substrate surface finish. The polishing pad surface is typically “conditioned,” whereby the polishing pad surface is deglazed and surface irregularities are removed, by scouring the polishing pad surface with an abrasive device known as an end effector.
SUMMARY OF THE INVENTION
In one aspect, the invention features an apparatus and a method for use in substrate polishing according to which a conditioner head is provided for receiving an end effector; the conditioner head is supported above the polishing pad surface to be conditioned; and the conditioner head is driven with an actuating force from a position that lies along a line that is substantially normal to the polishing pad surface to be conditioned so that an end effector attached to the conditioner head can condition the surface of the polishing pad.
In another aspect, the invention features an apparatus and a method for use in substrate polishing according to which pneumatic pressure is supplied through the conditioner head support arm to apply actuating force to the conditioner head so that an end effector attached to the conditioner head can condition the surface of the polishing pad.
In yet another aspect, the invention features an apparatus and a method for use in substrate polishing according to which the conditioner head support arm has a fluid channel extending therein and a fluid port, wherein the fluid channel is constructed to receive rinsing fluid and fluid port is constructed to direct rinsing fluid from the fluid channel toward the polishing pad surface to be conditioned.
Embodiments may include one or more of the following features. The conditioner may be supported above the polishing pad surface by a support arm, and an actuating force may be applied to the conditioner head by a driver. The driver may apply to the conditioner head actuating force that lies along a line that is substantially normal to the polishing pad surface to be conditioned. The driver may comprise a drive shaft coupled between the conditioner head and the support arm, and the drive shaft may be linearly actuatable toward and away from the polishing pad to be conditioned along a drive shaft axis that is substantially normal to the polishing pad surface. The driver may comprise a fluid membrane coupled between the drive shaft and an interior cavity, wherein the fluid membrane seals fluid within the interior cavity of the support arm as the drive shaft is linearly actuated. The drive shaft may be constructed to rotate the conditioner head. A gimbal mechanism may be coupled between the drive shaft and the conditioner head to allow the conditioner head to rotate and to tilt at an angle relative to the drive shaft axis. The support arm may have another end coupled to a base that is constructed to move the conditioner head over the polishing pad surface to be conditioned.
When a driving force is applied to a conditioner head from a position that does not lie along a line that is normal to a polishing pad surface, the driving force and the responsive normal force may result in the generation of torque that tends to raise the conditioner head off the polishing pad surface; such a torque may lead to instability and thereby reduce the ability to uniformly apply force against polishing pad surface. By driving the conditioner head with an actuating force from a position that lies along a line which is substantially normal to a polishing pad surface, in accordance with one aspect of the invention, the normal force and the driving force both lie along the same line and little or no torque is generated. The invention therefore allows force to be controllably and stably applied against a polishing pad surface, improving the uniformity with which a polishing pad surface can be conditioned and thereby improving the overall polishing process. Supplying rinsing fluid to the polishing pad surface through the support arm, in accordance with another aspect of the invention, allows the overall size of the polishing apparatus to be reduced and improves the ability to control the delivery of rinsing fluid.
Other features and advantages will become apparent from the following description, including the drawings and the claims.
REFERENCES:
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5245796 (1993-09-01), Miller et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5531635 (1996-07-01), Mogi et al.
patent: 5626509 (1997-05-01), Hayashi
patent: 5643067 (1997-07-01), Katsuoka et al.
patent: 5833519 (1998-11-01), Moore
patent: 6036583 (2000-03-01), Perlov et al.
patent: 0 774 323 A2 (1997-05-01), None
patent: 0 770 455 A1 (1997-05-01), None
Gantvarg Eugene
Perlov Ilya
Applied Materials Inc.
Fish & Richardson
Hail III Joseph J.
Nguyen George
LandOfFree
Conditioner apparatus for chemical mechanical polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conditioner apparatus for chemical mechanical polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conditioner apparatus for chemical mechanical polishing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2459810