Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-11-13
2007-11-13
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21585, C257SE21548
Reexamination Certificate
active
11098371
ABSTRACT:
A pattern formation method includes the steps of forming a flowable film made of a material with flowability; forming at least one of a concave portion and a convex portion provided on a pressing face of a pressing member onto the flowable film by pressing the pressing member against the flowable film; forming a solidified film by solidifying the flowable film, onto which the at least one of a concave portion and a convex portion has been transferred, through annealing at a first temperature with the pressing member pressed against the flowable film; and forming a pattern made of the solidified film burnt by annealing at a second temperature higher than the first temperature.
REFERENCES:
patent: 5772905 (1998-06-01), Chou
patent: 2005/0164494 (2005-07-01), Nakagawa et al.
patent: 2005/0170269 (2005-08-01), Nakagawa et al.
patent: 06-267943 (1994-09-01), None
patent: 07-121914 (1995-05-01), None
patent: 2000-194142 (2000-07-01), None
patent: 2001-252927 (2001-09-01), None
patent: 2002-158221 (2002-05-01), None
patent: 2003-077807 (2003-03-01), None
Chou, Stephen Y., et al. “Imprint of sub-25 nm vias and trenches in polymers.” Appl. Phys. Lett. 67 (21), Nov. 20, 1995, pp. 3114-3115.
Hirai Yoshihiko
Nakagawa Hideo
Sasago Masaru
Lindsay, Jr. Walter L
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
LandOfFree
Concave pattern formation method and method for forming... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Concave pattern formation method and method for forming..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Concave pattern formation method and method for forming... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3827017