Computer-aided thermal relief pad design system and method

Details Computer-aided thermal relief pad design system and method Computer-aided thermal relief pad design system and method

2006-05-01

2008-08-05

Lin, Sun J (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

07409661

ABSTRACT:
A computer-aided thermal relief pad design system includes a depicting unit, a memory unit and a calculating unit. The depicting unit is used for depicting an elongated oval pattern of a thermal relief pad. The elongated oval pattern includes two perpendicular axes that intersect at a center point, and a plurality of terminals. The memory unit is used for storing formulae defining relationships between lengths of the two axes and coordinates of the terminals. The coordinates of the terminal define positions of the terminals relative to the center point. The calculating unit is used for calculating the coordinates of the terminals based on the formulae stored in the memory unit.

REFERENCES:
patent: 5831826 (1998-11-01), Van Ryswyk
patent: 6823501 (2004-11-01), Dahl
patent: 6941535 (2005-09-01), Sekido
patent: 7002572 (2006-02-01), Teig et al.
Altium, “PCB Editor:Internal Power and Split Planes”, Dec. 9, 2003, Product Description (AR0126 v1.0), 9 pages.

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