Compressive pedestal for microminiature connections

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430315, 430317, 430329, 361400, 361403, 439 66, 439 74, G03C 500

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active

049026062

ABSTRACT:
Apparatus is disclosed for providing microelectronic, intra-chip and chip-to-chip interconnections in an ultra-dense integrated circuit configuration. Compressive pedestals 20 are used to form spring-loaded electrical and mechanical interconnections to conductive terminals on a chip interface mesa and chip assembly 28 in order to form a large multi-chip array 23 on an interconnection substrate 24. Methods are also disclosed for fabricating the compressive pedestals 20.

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Essert R. D., "Spring Pad for Etched-Circuit Electrical Connector", IBM Technical Disclosure Bulletin, vol. 7, No. 10, Mar. 1965, p. 873.

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