Compression bonded electronic device comprising a plurality of d

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357 74, 357 75, H01L 2302, H01L 2312, H01L 2342

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active

043131280

ABSTRACT:
An electronic device is provided comprising two or more discrete semiconductor devices in an electrical circuit relationship, hermetically sealed within a single case member. Electrical and thermal conductivity between the semiconductor devices and electrodes on the case member is established and maintained by the application of a compressive force to the case member. The compressive force applied to the case member is distributed to the individual semiconductor devices sealed within the case member.

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