Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Passivating of surface
Reexamination Certificate
2006-05-02
2006-05-02
Smith, Bradley K. (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Passivating of surface
C438S046000, C438S047000, C438S780000
Reexamination Certificate
active
07037741
ABSTRACT:
A method for manufacturing a compound semiconductor optoelectronic device is proposed. There are steps of: forming an optoelectronic device epitaxial wafer, the optoelectronic device epitaxial wafer containing a V-shaped pit due to threading dislocation; forming an insulated isolation material in the V-shaped pit of the optoelectronic device epitaxial wafer; and forming an electrode layer on the optoelectronic device epitaxial wafer having the insulated isolation material in the V-shaped pit for completing the optoelectronic device.
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Chang Chih-Sung
Chen Tzer-Perng
Tasi Tzong-Liang
Yang Yung-Chuan
Barkume, P.C. Anthony R.
Epistar Corporation
Fulk Steven
Smith Bradley K.
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