Compound semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S167000, C438S285000, C438S518000, C438S590000, C438S604000, C257S076000, C257SE29081, C257SE21403

Reexamination Certificate

active

08003452

ABSTRACT:
A compound semiconductor device includes a carrier transit layer formed over a substrate; a carrier supply layer formed over the carrier transit layer; a first metal film and a second metal film formed over the carrier supply layer; a first Al comprising film formed over the first metal film; a second Al comprising film formed over the second metal film; a first Au comprising film formed over the first metal film and is free of direct contact with the first Al comprising film; a second Au comprising film formed over the second metal film and free of direct contact with the second Al comprising film; and a gate electrode that is located over the carrier supply layer between the first metal film and the second metal film.

REFERENCES:
patent: 6417519 (2002-07-01), Imanishi et al.
patent: 6861679 (2005-03-01), Otsuka et al.
patent: 2008/0197359 (2008-08-01), Imanishi et al.
patent: 2008/0204140 (2008-08-01), Kikkawa et al.
patent: 2002-359256 (2002-12-01), None
patent: 2006-165207 (2006-06-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Compound semiconductor device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compound semiconductor device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compound semiconductor device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2668471

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.