Compound, dissolution inhibitor, positive type resist...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S905000

Reexamination Certificate

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07943284

ABSTRACT:
A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition.

REFERENCES:
patent: 6638684 (2003-10-01), Okubo et al.
patent: 6787284 (2004-09-01), Ogata et al.
patent: 2001/0041302 (2001-11-01), Kim et al.
patent: 2007/0275328 (2007-11-01), Shiono et al.
patent: 1736485 (2006-12-01), None
patent: 2006-78744 (2006-03-01), None
patent: 10-2001-0083547 (2001-09-01), None
patent: WO 2004/051372 (2003-12-01), None
Kim, J., et al. “Novel Molecular Resist Based on Derivative of Cholic Acid.” Chemistry Letters (2002), vol. 31, No. 10, pp. 1064-1065.
Office Action that issued in the counterpart Korean Application No. 10-2007-7023160, dated Jan. 23, 2009.
Hirayama, T., et al. “New Photoresist Based on Amorphous Low Molecular Weight Polyphenols.” Journal of Photopolymer Science and Technology (2004) vol. 17, No. 3. p. 435-440.
International Search Report from PCT/JP2006/308080 dated Jul. 11, 2006.
Kim, J., et al. “Novel Moleclar Resist Based on Derivative of Cholic Acid.” Chemistry Letters (2002). vol. 31, No. 10, p. 1064, Figure 1.
Office Action that issued in the counterpart Korean Application No. 10-2009-7013172, dated Aug. 28, 2009.

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