Compound clamp ring for semiconductor wafers

Details Compound clamp ring for semiconductor wafers Compound clamp ring for semiconductor wafers

1994-01-25

1995-06-06

Rivell, John

Heat exchange

With retainer for removable article

Electrical component

165 801, 1187281, 269254R, 269903, F28F 700, C23C 1500

Patent

active

054214017

ABSTRACT:
A compound clamp ring secures a semiconductor wafer having a wafer flat portion to a wafer pedestal during wafer processing while maintaining a continuous seal between the wafer edges and the wafer pedestal to prevent leakage of coolant gases circulated at the backside of the wafer into the process environment. The clamp ring has an annular wafer clamp surface adapted to press a round portion of the wafer into sealing abutment with the wafer pedestal. A cavity formed in the clamp ring securely receives a comb-like array of resilient flexures that are adapted to apply a yieldable bias to the flat portion of the wafer to complete the seal between the wafer and the pedestal at the flat portion of the wafer; and encloses the flexures to shield the flexures from process gases.

REFERENCES:
patent: 3711081 (1973-01-01), Cachon
patent: 4473455 (1984-09-01), Dean et al.
patent: 4915367 (1990-04-01), Carossino
patent: 4978412 (1990-12-01), Aoki et al.
patent: 5094885 (1992-03-01), Selbrede
patent: 5316278 (1994-05-01), Sherstinsky et al.

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