Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2006-01-10
2006-01-10
Deo, Duy-Vu N. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S692000, C438S693000
Reexamination Certificate
active
06984588
ABSTRACT:
A chemical mechanical polishing composition comprising a soluble cerium compound at a pH above 3 and a method to selectively polish a silicon oxide overfill in preference to a silicon nitride film layer in a single step during the manufacture of integrated circuits and semiconductors.
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NYACOL Colloidal Ceria Nitrate MSDS (Nov. 17, 1994).
Grover Gautam S.
Mueller Brian L.
Wang Shumin
Cabot Microelectronics Corporation
Deo Duy-Vu N.
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