Compositions for oxide CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

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C438S692000, C438S693000

Reexamination Certificate

active

06984588

ABSTRACT:
A chemical mechanical polishing composition comprising a soluble cerium compound at a pH above 3 and a method to selectively polish a silicon oxide overfill in preference to a silicon nitride film layer in a single step during the manufacture of integrated circuits and semiconductors.

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NYACOL Colloidal Ceria Nitrate MSDS (Nov. 17, 1994).

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