Compositions and processes for immersion lithography

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07968268

ABSTRACT:
New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that can be substantially non-mixable with a resin component of the resist. Further preferred photoresist compositions of the invention comprise 1) Si substitution, 2) fluorine substitution; 3) hyperbranched polymers; and/or 4) polymeric particles. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.

REFERENCES:
patent: 6479211 (2002-11-01), Sato et al.
patent: 6787286 (2004-09-01), Szmanda et al.
patent: 6806022 (2004-10-01), Kawabe et al.
patent: 6809794 (2004-10-01), Sewell
patent: 6852467 (2005-02-01), Aoai et al.
patent: 7264918 (2007-09-01), Endo et al.
patent: 2002/0051928 (2002-05-01), Zampini
patent: 2003/0198824 (2003-10-01), Fong et al.
patent: 2004/0009429 (2004-01-01), Sato
patent: 2004/0068023 (2004-04-01), Leatherdale et al.
patent: 2004/0248032 (2004-12-01), Zampini et al.
patent: 2004/0259040 (2004-12-01), Endo
patent: 2005/0084794 (2005-04-01), Meagley et al.
patent: 2005/0106494 (2005-05-01), Huang et al.
patent: 2005/0208419 (2005-09-01), Inabe et al.
patent: 2005/0238993 (2005-10-01), Watanabe et al.
patent: 2006/0008736 (2006-01-01), Kanda et al.
patent: 2006/0051702 (2006-03-01), Endo et al.
patent: 2006/0078823 (2006-04-01), Kanda et al.
patent: 2006/0166130 (2006-07-01), Ogata et al.
patent: 2006/0199100 (2006-09-01), Kanda
patent: 2006/0222866 (2006-10-01), Nakamura et al.
patent: 2006/0228648 (2006-10-01), Ohsawa et al.
patent: 0393673 (1990-10-01), None
patent: 0938026 (1999-08-01), None
patent: 1505439 (2005-02-01), None
patent: 1 580 598 (2005-09-01), None
patent: 1 621 927 (2006-02-01), None
patent: 1 645 908 (2006-04-01), None
patent: 11218927 (1999-08-01), None
patent: 2000010287 (2000-01-01), None
patent: 2000338676 (2000-12-01), None
patent: 2002333715 (2002-11-01), None
patent: 2004354953 (2004-12-01), None
patent: 2005099646 (2005-04-01), None
patent: 2005128146 (2005-05-01), None
patent: 2005234119 (2005-09-01), None
patent: 2006023692 (2006-01-01), None
patent: 2006-079048 (2006-03-01), None
patent: 2006071889 (2006-03-01), None
patent: 2006276444 (2006-10-01), None
patent: 2006276851 (2006-10-01), None
patent: 2007145797 (2007-06-01), None
patent: 2006048029 (2008-02-01), None
patent: 2004/076535 (2004-09-01), None
The Notice of Third Party Submission received from Japanese Associate's prosecuting the corresponding Japanese application dated Sep. 29, 2008.
Notice of Improper Request of the United States Patent and Trademark Office dated Sep. 3, 2008.
Technical Data Sheets relating to the products “Megaface R-08” available from DIC Corporation.
Web-site—cf.http://www.dic.co.jp/en/products/fluoro/additive/all.html, “PolyFox Grade Slate: PF-6520” available from Omnova Solutions Inc.
PF-6320 (x=20) available from Kitamura Chemicals.
English summary of Japanese Office Action for corresponding Japanese Application No. 2006-124957, issued Sep. 30, 2010.
European Examination Report for corresponding European Application No. 06 252 260.2, issued Jan. 27, 2011.
English summary of Chinese Office Action for corresponding Chinese Application No. 2006100798125.
English summary of Korean Office Action for corresponding Korean Application No. 10-2006-0039337.
English Summary of Taiwanese Examination Report dated Jan. 13, 2011 for corresponding Taiwanese Patent Application No. 095115195.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Compositions and processes for immersion lithography does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compositions and processes for immersion lithography, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compositions and processes for immersion lithography will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2700433

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.