Compositions and methods for polishing

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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437228, H01L 21306

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active

053912586

ABSTRACT:
Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.

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