Compositions and method for stripping gold from copper substrate

Details Compositions and method for stripping gold from copper substrate Compositions and method for stripping gold from copper substrate

1984-02-16

1984-11-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

75105, 156664, 252 795, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044837399

ABSTRACT:
An improved composition for selectively stripping gold from a metal substrate, especially copper metal, wherein the gold deposit is rapidly and effectively stripped without an attendant attack on the metal substrate. A minor amount of an organo mercapto compound, e.g. mercaptobenzothiazole, is added to the stripping composition to inhibit attack on the metal substrate.

REFERENCES:
patent: 2649361 (1953-08-01), Springer et al.
patent: 3102808 (1963-09-01), Weisberg et al.
patent: 3242090 (1966-03-01), Grunwald
patent: 3935005 (1976-01-01), Solidum et al.

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