Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Finishing or perfecting composition or product
Patent
1994-03-25
1995-08-08
Le, Hoa Van
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Finishing or perfecting composition or product
252 791, 252 794, 252150, 252173, 134 3, 134 41, 216106, G03C 1106
Patent
active
054397839
ABSTRACT:
A composition suitable for the treatment of surfaces of copper and copper alloys is disclosed. It comprises, (a) a cupric complex of an azole compound, (b) an organic acid having a boiling point or a decomposition point of 230.degree. C or lower, (c) a difficultly volatile complexing agent, (d) a complexing agent having a complexing power which is weaker than that of the azole compound, and (e) water. The treatment of copper or copper alloys with the composition produces abraded surface with moderate irregularities, thereby ensuring better adhesion of various resists thereto and increased solderability. The composition is particularly useful for the manufacture of printed-wiring boards.
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patent: 4264418 (1981-04-01), Wood et al.
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patent: 5219484 (1993-06-01), Krulik
Database WPI, Derwent Publications Ltd., AN 85-027934, JP-A-59 222584, Dec. 14, 1984.
Chemical Abstracts, vol. 113, No. 10, Sep. 3, 1990, AN 83398m, p. 311, IN 164,271 Feb. 11, 1989.
Akiyama Daisaku
Maki Yoshiro
Le Hoa Van
MEC Co. Ltd.
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