Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2006-10-02
2010-12-14
Maldonado, Julio J (Department: 2823)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S756000, C257SE21220, C257SE21250, C216S096000, C216S103000
Reexamination Certificate
active
07851372
ABSTRACT:
In one aspect, a composition is provided which is capable of removing an insulation material which includes at least one of a low-k material and a passivation material. The composition of this aspect includes about 5 to about 40 percent by weight of a fluorine compound, about 0.01 to about 20 percent by weight of a first oxidizing agent, about 10 to about 50 percent by weight of a second oxidizing agent, and a remaining water.
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Baek Kui-Jong
Hahn Woong
Kang Dong-Min
Kim Hyun-Joon
Kim Young-Nam
Kim Su C
Maldonado Julio J
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
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