Composition for removing an insulation material and related...

Details Composition for removing an insulation material and related... Composition for removing an insulation material and related...

2009-06-30

2010-11-30

Malsawma, Lex (Department: 2892)

Semiconductor device manufacturing: process

Miscellaneous

C510S175000

Reexamination Certificate

active

07842623

ABSTRACT:
A composition for removing an insulation material and related methods of use are disclosed. The composition comprises about 1 to 50 percent by weight of an oxidizing agent, about 0.1 to 35 percent by weight of a fluorine-containing compound, and water. The insulation material comprises at least one of a low-k material and a protection material.

REFERENCES:
patent: 3036885 (1962-05-01), Muller et al.
patent: 6017811 (2000-01-01), Winton et al.
patent: 6391794 (2002-05-01), Chen et al.
patent: 6573175 (2003-06-01), Yin et al.
patent: 6693047 (2004-02-01), Lu et al.
patent: 6890391 (2005-05-01), Aoki et al.
patent: 6896744 (2005-05-01), Morinaga et al.
patent: 7208325 (2007-04-01), Wang et al.
patent: 2007/0082497 (2007-04-01), Lee et al.
patent: 2001065459 (2001-03-01), None
patent: 2002134468 (2002-05-01), None
patent: 2002246378 (2002-08-01), None
patent: 2004325918 (2004-11-01), None
patent: 2005167181 (2005-06-01), None
patent: 1998070026 (1998-10-01), None
patent: 1020020055888 (2002-07-01), None
patent: 1020020081923 (2002-10-01), None
patent: 1020040077043 (2004-09-01), None
patent: 1020040102981 (2004-12-01), None

Affiliated with

Also associated with

Rating

Composition for removing an insulation material and related... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition for removing an insulation material and related..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition for removing an insulation material and related... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4156998