Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2011-04-06
2011-11-15
Webb, Gregory (Department: 1761)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000
Reexamination Certificate
active
08058221
ABSTRACT:
Provided are a composition for removing a photoresist and a method of manufacturing a semiconductor device using the composition. The composition includes about 60-90 wt % of dimethyl sulfoxide, about 10-30 wt % of a polar organic solvent, about 0.5-1.5 wt % of hydroxy alkyl ammonium and about 1-10 wt % of an amine containing no hydroxyl group.
REFERENCES:
patent: 6797682 (2004-09-01), Hara et al.
patent: 6869921 (2005-03-01), Koito et al.
patent: 6916772 (2005-07-01), Zhou et al.
patent: 7049275 (2006-05-01), Ikemoto et al.
patent: 7051742 (2006-05-01), Lee et al.
patent: 7144849 (2006-12-01), Lee et al.
patent: 7543592 (2009-06-01), Lee
patent: 7579308 (2009-08-01), Lee
patent: 7674755 (2010-03-01), Egbe et al.
patent: 7960328 (2011-06-01), Visintin et al.
patent: 7968507 (2011-06-01), Lee et al.
patent: 2002/0128164 (2002-09-01), Hara et al.
patent: 2003/0130147 (2003-07-01), Koito et al.
patent: 2003/0130149 (2003-07-01), Zhou et al.
patent: 2003/0181344 (2003-09-01), Ikemoto et al.
patent: 2004/0106532 (2004-06-01), Yokoi et al.
patent: 2005/0263743 (2005-12-01), Lee
patent: 2006/0003910 (2006-01-01), Hsu et al.
patent: 2006/0094613 (2006-05-01), Lee
patent: 2006/0115970 (2006-06-01), Lee
patent: 2007/0027052 (2007-02-01), Yokoi et al.
patent: 2009/0084406 (2009-04-01), Lee et al.
patent: 1020020058995 (2002-07-01), None
Ahn Seunghyun
Bae Dongchan
Cho Kyoo-chul
Choi Baik-soon
Kang Dong-Min
Cheil Industries Inc.
F. Chau & Associates LLC
Samsung Electronics Co,. Ltd.
Webb Gregory
LandOfFree
Composition for removing a photoresist and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composition for removing a photoresist and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition for removing a photoresist and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4299287