Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-03-02
2010-12-14
Lee, Sin J. (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S281100, C430S285100, C430S271100, C430S905000, C430S916000
Reexamination Certificate
active
07851124
ABSTRACT:
A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.
REFERENCES:
patent: 4421841 (1983-12-01), Shimizu et al.
patent: 2002/0182536 (2002-12-01), Kamada et al.
patent: 11-052569 (1999-02-01), None
patent: 11-052570 (1999-02-01), None
patent: 11-130858 (1999-05-01), None
patent: 2002-241468 (2002-08-01), None
patent: 2002-278065 (2002-09-01), None
patent: 2004-269622 (2004-09-01), None
JPO English abstract for JP 2002-241468 (Koyanagi et al).
JPO English abstract for JP 2004-269622 (Kodama).
JPO Engish abstract for JP11-130858.
Machine-assisted English translation of JP11-130858 as provided by JPO.
English Abstract of Japanese Patent Publication No. 10-289432, published Oct. 27, 1998.
English Abstract of Japanese Patent Publication No. 11-286082, published Oct. 19, 1999.
Fujita Kazuhito
Funaki Katsuhiko
Ohkawado Etsuo
Tahara Shuji
Tsuda Takeshi
Buchanan & Ingersoll & Rooney PC
Lee Sin J.
Mitsui Chemicals Inc.
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