Composition/bandgap selective dry photochemical etching of semic

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156655, 156662, H01L 21306

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046489380

ABSTRACT:
A method of selectively photochemically dry etching a first semiconductor material of a given composition and direct bandgap Eg.sub.1 in the presence of a second semiconductor material of a different composition and direct bandgap Eg.sub.2, wherein Eg.sub.2 >Eg.sub.1, said second semiconductor material substantially not being etched during said method, comprises subjecting both materials to the same photon flux and to the same gaseous etchant under conditions where said etchant would be ineffective for chemical etching of either material were the photons not present, said photons being of an energy greater than Eg.sub.1 but less than Eg.sub.2, whereby said first semiconductor material is photochemically etched and said second material is substantially not etched.

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patent: 4331504 (1982-05-01), Chuang et al.
patent: 4351706 (1982-09-01), Chappell et al.
patent: 4404072 (1983-09-01), Kohl et al.
patent: 4454004 (1984-06-01), Hackleman et al.
Kern, "Chemical Etching . . . Gallium Phosphide", RCA Review 39, (1978), pp. 278-308.
Houle, "Non-Thermal Effects in Laser-Enhanced Etching of Silicon by XeF.sub.2 ", Chem. Phys. Lett. 95, (1983), pp. 5-8.

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