Composition and thickness variation in dielectric layers

Details Composition and thickness variation in dielectric layers Composition and thickness variation in dielectric layers

1983-06-30

1984-01-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156657, 1566591, 1566611, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

044262493

ABSTRACT:
A method of precisely controlling the thickness of dielectric islands on a substrate is provided. The subject method comprises forming a patterned layer of an etchable metal over a first dielectric layer on a substrate, forming a second layer of dielectric material thereover so that there is contact where the etchable metal layer has been removed, patterning the second dielectric layer so that islands remain only over the openings in the etchable layer, removing the etchable metal layer and then patterning the first dielectric layer. There are thus provided islands of dielectric material on the substrate having a thickness equal to the first only or the first and second dielectric layers together, respectively. The process may be extended to form at least one additional layer of dielectric material on certain of the islands.

REFERENCES:
patent: Re29947 (1979-03-01), Van Ommeren
patent: 4184909 (1980-01-01), Chang et al.
patent: 4289834 (1981-09-01), Alcorn et al.
patent: 4307179 (1981-12-01), Chang et al.
patent: 4376287 (1983-03-01), Sechi

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