Composition and process for printed circuit etching using a sulf

Details Composition and process for printed circuit etching using a sulf Composition and process for printed circuit etching using a sulf

1982-09-07

1983-08-30

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156901, 252 794, C23F 100

Patent

active

044015097

ABSTRACT:
Compositions are provided suitable for the etching of printed circuits from a laminate of copper metal and an etch resistant backing at a low hydrogen peroxide concentration and at a low temperature. The etching composition contains sulfuric acid, hydrogen peroxide as the oxidant, thiosulfate ion to counteract the depressing effect of chloride ion on the etch rate, an unsaturated organic hydroxy compound to stabilize the hydrogen peroxide in the presence of copper, and an aminomethylenephosphonic acid.

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