Composition and process for filling vias

Details Composition and process for filling vias Composition and process for filling vias

1996-07-18

1998-04-28

Baxter, Janet C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430326, 430325, 430331, G03C 500

Patent

active

057442851

ABSTRACT:
Electrolytic and electroless processes which use a solid plug of polymer thick film composition to fill throughholes and composition therefor. The composition comprises a trimodal conductive mixture dispersed in an organic vehicle wherein the trimodal conductive mixture consists of particles of spherical silver, flake silver and silver-coated copper.

REFERENCES:
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 3989644 (1976-11-01), Bolon et al.
patent: 4827083 (1989-05-01), Inasaka et al.
patent: 5386627 (1995-02-01), Booth et al.

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