Composition and method for stripping tin or tin-lead alloy from

Details Composition and method for stripping tin or tin-lead alloy from Composition and method for stripping tin or tin-lead alloy from

1990-07-17

1991-05-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 3, 156664, 156902, 252 794, 252 795, 252142, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

050172670

ABSTRACT:
An aqueous composition for stripping tin or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, ferric nitrate, and a source of chlorate ion. The composition effects stripping without any appreciable formation of sludge or precipitate or suspended particles, and the chlorate component enables significant reduction in the concentration of alkane sulfonic acid otherwise needed for the stripping. Also described are stripping compositions containing a source of chlorate ion and an acid for solubilizing stripped tin or tin-lead, such as alkane sulfonic acid, acetic acid, formic acid and the like.

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