Composition and method for stripping films from printed circuit

Details Composition and method for stripping films from printed circuit Composition and method for stripping films from printed circuit

1986-08-01

1987-12-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 3, 134 41, 156640, 156664, 156666, 156902, 252 792, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

047131446

ABSTRACT:
A composition and method for stripping solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board with a single application of the composition. An aqueous solution of nitric acid, ferric nitrate and sulfamic acid, which may be sprayed directly onto the printed circuit board for removing both the solder and the alloy.

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patent: 4554049 (1985-11-01), Bastenbeck

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