Composition and method for etching copper substrates

Details Composition and method for etching copper substrates Composition and method for etching copper substrates

1980-07-15

1982-01-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156666, 156902, 252 795, C23F 102, C03C 1500, C03C 2506, B44F 122

Patent

active

043115519

ABSTRACT:
An alkaline copper etching working bath for dissolving copper containing an etch accelerating additive selected from the group consisting of cyanamide and its precursors. The accelerating additives when added to the alkaline copper etching bath increase the etch rate and reduce undercut. The bath includes cupric ions, an ammonium salt such as a chloride and/or a carbonate, ammonium hydroxide to achieve a pH greater than 7, water, and the etch accelerating additive. The invention includes etching baths, methods for their use, the preparation of a certain etch accelerating additive and the provision of certain cyanamide precursors.

REFERENCES:
patent: 3033725 (1962-05-01), Daugherty et al.
patent: 3161552 (1964-12-01), Bradley et al.
patent: 3287191 (1966-11-01), Borth
patent: 3753818 (1973-08-01), Poor et al.
patent: 3809588 (1974-05-01), Zeblisky

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