Etching a substrate: processes – Mechanically shaping – deforming – or abrading of substrate – Nongaseous phase etching
Reexamination Certificate
2006-11-13
2010-11-23
Olsen, Allan (Department: 1716)
Etching a substrate: processes
Mechanically shaping, deforming, or abrading of substrate
Nongaseous phase etching
C451S037000, C051S307000
Reexamination Certificate
active
07837888
ABSTRACT:
The invention provides a method of chemically-mechanically polishing a substrate having at least one feature defined thereon, wherein the feature has at least one dimension with a size W, with a chemical-mechanical polishing composition. The polishing composition comprises particles of an abrasive wherein the particles have a mean particle diameter DMwherein the mean particle diameter of the particles satisfies the equation: DM>W. The invention further provides a method of preparing the chemical-mechanical polishing composition.
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Anjur Sriram
Dysard Jeffrey M.
Feeney Paul M.
Cabot Microelectronics Corporation
Koszyk Francis J.
Olsen Allan
Omholt Thomas E.
Weseman Steven D.
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