Composite substrate carrier

Details Composite substrate carrier Composite substrate carrier

2007-01-30

2007-01-30

Luong, Shian T. (Department: 3728)

Special receptacle or package

For plate or sheet

Fragile or sensitive

C206S711000

Reexamination Certificate

active

11092528

ABSTRACT:
A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

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