Composite sputtering target structures and process for producing

Details Composite sputtering target structures and process for producing Composite sputtering target structures and process for producing

1991-03-14

1993-06-01

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

156242, 20429812, C23C 1434

Patent

active

052156397

ABSTRACT:
A target structure is provided for use in a magnetically enhanced diode sputter coating source having a sputtering target which at end-of-life has an eroded surface with a known shape. The sputtering target has a non-sputtered profiled back surface conforming substantially in shape to the eroded surface at end-of-life. A backing plate is bonded to the sputtering target which has a bonding surface complementary to the non-sputtered back surface of the sputtering target and is designed to mate therewith. A method is provided for fabricating the target structure and bonding the sputtering target to the backing plate by isostatic pressing.

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