Composite sacrificial material

Details Composite sacrificial material Composite sacrificial material

2006-03-28

2006-03-28

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S627000, C148S033300, C257S758000

Reexamination Certificate

active

07018920

ABSTRACT:
A composite sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The composite sacrificial material includes a polymeric or oligomeric matrix with filler material mixed therein. The filler material may be particulate matter that may be used to modify one or more properties of the composite sacrificial material during semiconductor processing.

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