Composite having conductive layer on resin layer and method of m

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430324, 430328, 430330, 427307, 427314, G03C 500

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046457348

ABSTRACT:
In manufacturing a composite having a conductive layer on the surface of a resin layer, the first resin layer of polyimide is formed on a substrate of alumina ceramic and, after a resin layer is thermally set by heating, a second resin layer of polyimide is then formed on the first resin layer and is dried. Then the surface of the second resin layer is subjected to selective photoetching by using a photomask having predetermined small opaque areas distributed, thereby to form unevenness including concaves formed as a result of the selective photoetching. The layered composite thus obtained is then heated so that the second resin layer is thermally set. Then catalyst nuclei are formed for electroless plating on the etched surface having the unevenness formed and then a conductive metallic layer is formed by an electroless plating process on the etched surface having the unevenness formed. As a result, a composite of the above described structure is provided.

REFERENCES:
patent: 3979549 (1976-09-01), Wilkinson
patent: 4218283 (1980-08-01), Saiki et al.
Photochemical Image Formation Process for High Density Printed Circuit Patterns, Takahashi et al, Electrocomponent Sci. & Tech., 1981, vol. 8, Nos. 1 & 2, 99-102.

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