Composite electrode for plasma processes

Details Composite electrode for plasma processes Composite electrode for plasma processes

1990-09-18

1991-12-24

Heinrich, Samuel M.

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228122, 228177, 20429801, 445 51, 156345, 361229, 295921, B44C 122, C23C 1500, B01J 1908, C23F 102

Patent

active

050744569

ABSTRACT:
An electrode assembly for a plasma reactor, such as a plasma etch or plasma-enhanced chemical vapor deposition reactor, comprises an electrode plate having a support frame attached to one surface thereof. The electrode plate is composed of a substantially pure material which is compatible with a particular reaction being performed in the reactor, while the support frame is composed of a material having desirable thermal, electrical, and structural characteristics. The support frame is bonded to the electrode plate using a bonding layer, usually a ductile metallic bonding layer, which provides effective thermal and electrical coupling while permitting a degree of thermal expansion mismatch between the support frame and the electrode plate.

REFERENCES:
patent: 4158589 (1979-06-01), Keller et al.
patent: 4407708 (1983-10-01), Landau
patent: 4534816 (1985-08-01), Chen et al.
patent: 4590042 (1986-05-01), Drage
patent: 4595484 (1986-06-01), Giammarco et al.
patent: 4612077 (1986-09-01), Tracy et al.
patent: 4793975 (1988-12-01), Drage

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