Composite and circuit board having conductive layer on resin lay

Details Composite and circuit board having conductive layer on resin lay Composite and circuit board having conductive layer on resin lay

1985-04-09

1987-02-17

Kittle, John E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156635, 156650, 156652, 156656, 427307, 427314, B44C 122, C03C 1500

Patent

active

046437983

ABSTRACT:
In manufacturing a composite having a conductive layer on the surface of a resin layer, first the resin layer of a mixture of a resin material and filler elements is formed on a substrate and the resin material of the surface of the resin layer is selectively etched with respect to the filler elements to expose a portion of the filler elements, and then the filler elements, as exposed on the selectively etched surface of the resin layer, are selectively etched with respect to the resin material to form unevenness. Then catalyst nuclei are formed for electroless plating on the selectively etched surface having the unevenness and then a conductive metallic layer is formed by an electroless plating process on the selectively etched surface having unevenness. As a result, a composite of the above described structure is provided.

REFERENCES:
patent: 3801427 (1974-04-01), Morishita et al.
patent: 4317856 (1982-03-01), Huthwelker et al.
patent: 4349421 (1982-09-01), Khattab
patent: 4410394 (1983-10-01), Stalcup et al.
patent: 4475983 (1984-10-01), Bader et al.
patent: 4521475 (1985-06-01), Riccio et al.

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