Component packaging apparatus, systems, and methods

Details Component packaging apparatus, systems, and methods Component packaging apparatus, systems, and methods

2007-10-03

2010-10-19

Nguyen, Thinh T (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S725000, C438S780000, C257S642000, C257S643000

Reexamination Certificate

active

07816171

ABSTRACT:
Dielectric materials comprising release agents are described. Also described are a process for improving the processability of dielectric materials during hot embossing, substrates prepared by hot embossing, and integrated-circuit packages comprising the improved substrate.

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