Component mounting method, component mounting apparatus, and...

Details Component mounting method, component mounting apparatus, and... Component mounting method, component mounting apparatus, and...

2011-01-04

2011-01-04

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

C228S180100

Reexamination Certificate

active

07861908

ABSTRACT:
A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

REFERENCES:
patent: 3166840 (1965-01-01), Bancroft et al.
patent: 3727822 (1973-04-01), Umbaugh
patent: 6168063 (2001-01-01), Sato et al.
patent: 6193136 (2001-02-01), Higashi et al.

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