Component mounting method

Details Component mounting method Component mounting method

2008-04-08

2008-04-08

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C228S180220

Reexamination Certificate

active

10549175

ABSTRACT:
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

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patent: 2004/0003891 (2004-01-01), Cheng et al.
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patent: 2000-012717 (2000-01-01), None
patent: 2000-022394 (2000-01-01), None

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